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Deformation Kinetics of Wiring Ribbons during Ultrasonic Bonding

Deformation Kinetics of Wiring Ribbons during Ultrasonic Bonding

MAEDA, Masakatsu; KITAMURA, Hideki; TAKAHASHI, Yasuo

期刊名称Journal of Smart Processing
作者MAEDA, Masakatsu; KITAMURA, Hideki; TAKAHASHI, Yasuo
卷第4卷
期第2期
印刷ISSN2186-702X
电子ISSN2187-1337
文件大小996.21KB
发表时间2015
DOI10.7791/jspmee.4.89
页码89-94

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