Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process
- 期刊名称Journal of Alloys and Compounds
- 作者Yao, Yao; Zhou, Jian; Xue, Feng; Chen, Xu
- 卷第682卷
- 印刷ISSN0925-8388
- 文件大小2247.25KB
- 发表时间2016-10
- DOI10.1016/j.jallcom.2016.04.263
- 页码627-633
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