Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates

• 期刊名称Materials Science and Engineering: A
• 作者Chen, Xu; Zhou, Jian; Xue, Feng; Yao, Yao
• 卷第662卷
• 印刷ISSN0921-5093
• 文件大小3778.20KB
• 发表时间2016-04
• DOI10.1016/j.msea.2016.03.072
• 页码251-257