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Time-Efficient Curing of Printed Dielectrics via Infra-Red Suitable to S2S and R2R Manufacturing Platforms for Electronic Devices

Time-Efficient Curing of Printed Dielectrics via Infra-Red Suitable to S2S and R2R Manufacturing Platforms for Electronic Devices

Mitra, Kalyan Yoti; Weise, Dana; Hartwig, Melinda; Kapadia, Sunil; Baumann, Reinhard R.
  • 期刊名称IEEE Transactions on Electron Devices
  • 作者Mitra, Kalyan Yoti; Weise, Dana; Hartwig, Melinda; Kapadia, Sunil; Baumann, Reinhard R.
  • 印刷ISSN0018-9383
  • 电子ISSN1557-9646
  • 文件大小1875.34KB
  • 发表时间2016
  • DOI10.1109/ted.2016.2560945
  • 页码1-8
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