[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Is electron transport in nanocrystalline Cu interconnects surface dominated or grain boundary dominated?
- 作者Hegde, Ganesh; Bowen, R. Chris; Rodder, Mark S.
- 文件大小526.13KB
- 发表时间2016
- DOI10.1109/IITC-AMC.2016.7507701
- 页码114-116
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