[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Highly integrated thermoelectric coolers
Barletta, Phil; Vick, Erik; Baldasaro, Nick; Temple, Dorota
- 作者Barletta, Phil; Vick, Erik; Baldasaro, Nick; Temple, Dorota
- 文件大小357.58KB
- 发表时间2016
- DOI10.1109/ITHERM.2016.7517722
- 页码1477-1481