Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Kim, Do-Hyoung; Joo, Sung-Jun; Kwak, Dong-Ok; Kim, Hak-Sung
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小2279.61KB
- 发表时间2016
- DOI10.1109/TCPMT.2016.2612637
- 页码1-10
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