[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
- 作者Lu, Yao; Nie, Zhiqiang; Zhang, Pu; Wang, Zhenfu; Xiong, Lingling; Wang, Shuna; Wu, Dihai; Liu, Xingsheng
- 文件大小2218.46KB
- 发表时间2016
- DOI10.1109/icept.2016.7583094
- 页码76-83
The gravimetric determination of germaniumDavies, Glyn Rees; Morgan, Gilbert · The Analyst · 1938
NotesHeadridge, J. B.; Taylor, M. S.; Bloxam, T. W. · The Analyst · 1962
Thermal lens spectrometry. A reviewSnook, Richard D.; Lowe, Roger D. · The Analyst · 1995
Fluorescence spectrometry. A reviewParker, C. A.; Rees, W. T. · The Analyst · 1962
Biochemically functionalized silica nanoparticlesQhobosheane, Monde; Santra, Swadeshmukul; Zhang, Peng; Tan, Weihong · The Analyst · 2001
Printing conducting polymersWeng, B.; Shepherd, R. L.; Crowley, K.; Killard, A. J.; Wallace, G. G. · The Analyst · 2010
A new test for ‘sufficient homogeneity’Fearn, Tom; Thompson, Michael · The Analyst · 2001
Standard additions: myth and realityEllison, Stephen L. R.; Thompson, Michael · The Analyst · 2008