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Reliability of Ag Sintering for Power Semiconductor Die Attach in High Temperature Applications

Reliability of Ag Sintering for Power Semiconductor Die Attach in High Temperature Applications

Yu, Fang; Cui, Jinzi; Zhou, Zhangming; Fang, Kun; Johnson, R. Wayne; Hamilton, Michael C.
  • 期刊名称IEEE Transactions on Power Electronics
  • 作者Yu, Fang; Cui, Jinzi; Zhou, Zhangming; Fang, Kun; Johnson, R. Wayne; Hamilton, Michael C.
  • 印刷ISSN0885-8993
  • 电子ISSN1941-0107
  • 文件大小7664.17KB
  • 发表时间2016
  • DOI10.1109/tpel.2016.2631128
  • 页码1-1
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