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[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Cost-effective characterization of dissipative loss of printed circuit board traces

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Cost-effective characterization of dissipative loss of printed circuit board traces

Xiao, Kai; Ye, Xiaoning; Hsu, Jimmy; Su, Thonas; Li, Yuan-Liang
  • 作者Xiao, Kai; Ye, Xiaoning; Hsu, Jimmy; Su, Thonas; Li, Yuan-Liang
  • 文件大小648.96KB
  • 发表时间2016
  • DOI10.1109/isemc.2016.7571692
  • 页码461-466
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