[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bump
- 作者Ong, Cheng-Guan; Lau, Kok-Tee; Zaimi, Muhammad; Afiq, Muhammad; Queck, Kian-Pin
- 文件大小1550.47KB
- 发表时间2016
- DOI10.1109/IMPACT.2016.7799982
- 页码319-322
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