[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Characterization of 2.5D package warpage through Shadow Moiré technique and failure analysis
- 作者Liu, Haiyan; Yu, Daquan; He, Hongwen; Liu, Xiaoyang; Lin, Tingyu
- 文件大小787.22KB
- 发表时间2016
- DOI10.1109/icept.2016.7583413
- 页码1526-1529
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