![[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 10µm pitch Cu-Cu bonding interconnection for wafer level 3D integration]()
[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 10µm pitch Cu-Cu bonding interconnection for wafer level 3D integrationSong, Chongshen; Li, Hengfu; Feng, Guangjian; Cao, Liqiang; Zhang, Wenqi · 2016