The effect of Ni on the kinetics of electroless Cu film deposition

• 期刊名称Thin Solid Films
• 作者Logan, Eric; Sharma, Tanu; Brüning, Frank; Zarwell, Sebastian; Steinhäuser, Edith; Bernhard, Tobias; Chen, Ning; Brüning, Ralf
• 卷第626卷
• 印刷ISSN0040-6090
• 文件大小2456.57KB
• 发表时间2017-03
• DOI10.1016/j.tsf.2017.02.026
• 页码131-139