Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias
- 期刊名称IEEE Transactions on Nanotechnology
- 作者Lu, Qijun; Zhu, Zhangming; Yang, Yintang; Ding, Ruixue; Li, Yuejin
- 印刷ISSN1536-125X
- 电子ISSN1941-0085
- 文件大小1572.15KB
- 发表时间2017
- DOI10.1109/TNANO.2017.2708509
- 页码1-1
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