[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
- 作者Auersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S.
- 文件大小14532.77KB
- 发表时间2017
- DOI10.1109/eurosime.2017.7926235
- 页码1-5
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