发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Jiang, Qian; Deshpande, Abhishek; Dasgupta, Abhijit
  • 作者Jiang, Qian; Deshpande, Abhishek; Dasgupta, Abhijit
  • 文件大小1475.35KB
  • 发表时间2017
  • DOI10.1115/IPACK2017-74133
同作者推荐
同期刊推荐
← 返回【学霸图书馆】主页
© 2026 学霸图书馆 · 让阅读成为习惯