[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
- 作者Zoschke, Kai; Guttler, Maurice; Bottcher, Lars; Grubl, Andreas; Husmann, Dan; Schemmel, Johannes; Meier, Karlheinz; Ehrmann, Oswin
- 文件大小1403.64KB
- 发表时间2017
- DOI10.1109/EPTC.2017.8277579
- 页码1-8
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