[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - [Back cover]

• 文件大小62.03KB
• 发表时间2017
• DOI10.1109/itherm.2017.7992652
• 页码1-1