[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Investigation on the ESD failure mechanism of integrated circuits in a 0.11µm CMOS process
Shao, Jin; Qiao, Yanbin; Ma, Qiang; Li, Jianqiang; Chen, Yanning; Yuan, Yidong; Tang, Xiaoke; Zhang, Haifeng; Zhao, Dongyan
- 作者Shao, Jin; Qiao, Yanbin; Ma, Qiang; Li, Jianqiang; Chen, Yanning; Yuan, Yidong; Tang, Xiaoke; Zhang, Haifeng; Zhao, Dongyan
- 文件大小19250.34KB
- 发表时间2017
- DOI10.1109/ICEPT.2017.8046409
- 页码69-71