[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Microstructure and properties of AlCrFeNi intermetallic for electronic packaging shell
- 作者Ren, Mingxing; Wang, Guotian; Li, Bangsheng
- 文件大小1209.22KB
- 发表时间2017
- DOI10.1109/ICEPT.2017.8046570
- 页码817-820
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