[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equations
Zhang, Ying; Wang, Yansheng; Xu, Jun; Sui, Chunchun; Sen, Bidyut; Jin, Shuai; Fan, Jun
- 作者Zhang, Ying; Wang, Yansheng; Xu, Jun; Sui, Chunchun; Sen, Bidyut; Jin, Shuai; Fan, Jun
- 文件大小597.96KB
- 发表时间2017
- DOI10.1109/isemc.2017.8077879
- 页码272-276