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Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters

Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters

Zhang, Yi; Wang, Huai; Wang, Zhongxu; Yang, Yongheng; Blaabjerg, Frede
  • 期刊名称IEEE Transactions on Industrial Electronics
  • 作者Zhang, Yi; Wang, Huai; Wang, Zhongxu; Yang, Yongheng; Blaabjerg, Frede
  • 印刷ISSN0278-0046
  • 电子ISSN1557-9948
  • 文件大小13236.19KB
  • 发表时间2018
  • DOI10.1109/TIE.2018.2823664
  • 页码1-1
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