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Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

Lai, Yanqing; Hu, Xiaowu; Li, Yulong; Jiang, Xiongxin
  • 期刊名称Journal of Materials Science: Materials in Electronics
  • 作者Lai, Yanqing; Hu, Xiaowu; Li, Yulong; Jiang, Xiongxin
  • 印刷ISSN0957-4522
  • 电子ISSN1573-482X
  • 文件大小3028.34KB
  • 发表时间2018-5-4
  • DOI10.1007/s10854-018-9219-5
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