[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Rapid electro-thermal modeling for 3D integration using circuit simulation techniques
Shiue, Gene; Schutt-Aine, Jose
- 作者Shiue, Gene; Schutt-Aine, Jose
- 文件大小177.67KB
- 发表时间2018
- DOI10.1109/ISEMC.2018.8394042
- 页码63-63