(Invited) Self-Healing Interconnects for Reliable Flexible Electronics
- 期刊名称ECS Transactions
- 作者Parab, Virendra; Ding, Li; Kumar, Amit; Yaswant, Vaddi; Sambandan, Sanjiv
- 卷第85卷
- 期第13期
- 印刷ISSN1938-6737
- 电子ISSN1938-5862
- 文件大小1608.09KB
- 发表时间2018-06-19
- DOI10.1149/08513.0825ecst
- 页码825-831
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