[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature
Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
- 作者Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
- 文件大小2091.85KB
- 发表时间2018
- DOI10.1109/ITHERM.2018.8419471
- 页码1296-1308