[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A Numerical Study of Heat Transfer and Fluid Flow in a Channel with an Array of Pin Fins in Aligned and Staggered Configurations
Issa, Johnny; Saliba, Najib; Cheikh, Amina El
- 作者Issa, Johnny; Saliba, Najib; Cheikh, Amina El
- 文件大小232.76KB
- 发表时间2018
- DOI10.1109/itherm.2018.8419645
- 页码513-520