[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Experimental Characterization of a Microchannel Heat Sink Made by Additive Manufacturing
Collins, Ivel L.; Weibel, Justin A.; Pan, Liang; Garimella, Suresh V.
- 作者Collins, Ivel L.; Weibel, Justin A.; Pan, Liang; Garimella, Suresh V.
- 文件大小336.76KB
- 发表时间2018
- DOI10.1109/ITHERM.2018.8419588
- 页码171-177