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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Roma (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Advanced sensor systems by low-temperature heterogeneous 3D integration processes

[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Roma (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Advanced sensor systems by low-temperature heterogeneous 3D integration processes

Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter

作者Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter
文件大小6508.62KB
发表时间2018
DOI10.1109/DTIP.2018.8394203
页码1-5

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