[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Development of a High Resolution Magnetic Field Position Sensor System Based on a Through Silicon Via First Integration Concept
Zoschke, Kai; Oppermann, Hermann; Paul, Johannes; Knoll, Heiko; Braun, Franz-Josef; Saumer, Monika; Theis, Martin; Frank, Peter; Lenkl, Andreas; Klose, Fabian
- 作者Zoschke, Kai; Oppermann, Hermann; Paul, Johannes; Knoll, Heiko; Braun, Franz-Josef; Saumer, Monika; Theis, Martin; Frank, Peter; Lenkl, Andreas; Klose, Fabian
- 文件大小972.94KB
- 发表时间2018
- DOI10.1109/ECTC.2018.00141
- 页码916-925