[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Ni barrier layer thickness on IMCs evolution in Ф5μm Cu/Ni/Sn pillar bumps

• 作者Chen, Kai; Ling, Huiqin; Guo, Fayao; Li, Ming; Zhang, Wenqi; Cao, Liqiang
• 文件大小4176.61KB
• 发表时间2018
• DOI10.1109/ICEPT.2018.8480711
• 页码190-194