[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Study and application on thermal EOP (Electro Optical Probing) / EOFM (Electro Optical Frequency Mapping) technique
He, Chi; Zhang, Haus; Song, Jinrong; Tian, Power; Wang, Winter
- 作者He, Chi; Zhang, Haus; Song, Jinrong; Tian, Power; Wang, Winter
- 文件大小800.21KB
- 发表时间2018
- DOI10.1109/IPFA.2018.8452556
- 页码1-4