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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Research on Thermal Analysis of Iris Recognition Module Package Structure

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Research on Thermal Analysis of Iris Recognition Module Package Structure

Yang, Zhangping; Yang, Daoguo; Wang, Lei; Wang, Xiyou; Cai, Miao
  • 作者Yang, Zhangping; Yang, Daoguo; Wang, Lei; Wang, Xiyou; Cai, Miao
  • 文件大小3578.59KB
  • 发表时间2018
  • DOI10.1109/ICEPT.2018.8480569
  • 页码899-903
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