[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Metal-Organic Frameworks Derived PdCu/C As an Efficient Catalyst for Electroless Copper Deposition
- 作者Chen, Jiahui; Ye, Huangqing; Xie, Jinqi; Yan, Changzeng; Sun, Rong; Wong, Ching-Ping
- 文件大小4455.20KB
- 发表时间2018
- DOI10.1109/ICEPT.2018.8480626
- 页码306-308
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