[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Fault Isolation of Die-to-Die Communication Error Failure
- 作者Jinrong, Song; Li, Tian; Jun, Ren; Hairong, Di; Jianli, Yang
- 文件大小1920.59KB
- 发表时间2018
- DOI10.1109/IPFA.2018.8452505
- 页码1-4