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[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding

[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding

Dymel, Collin; Schemmel, Reinhard; Hemsel, Tobias; Sextro, Walter; Brokelmann, Michael; Hunstig, Matthias
  • 作者Dymel, Collin; Schemmel, Reinhard; Hemsel, Tobias; Sextro, Walter; Brokelmann, Michael; Hunstig, Matthias
  • 文件大小7.66KB
  • 发表时间2018
  • DOI10.1109/ICSJ.2018.8602653
  • 页码41-44
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