[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
Dymel, Collin; Schemmel, Reinhard; Hemsel, Tobias; Sextro, Walter; Brokelmann, Michael; Hunstig, Matthias
- 作者Dymel, Collin; Schemmel, Reinhard; Hemsel, Tobias; Sextro, Walter; Brokelmann, Michael; Hunstig, Matthias
- 文件大小7.66KB
- 发表时间2018
- DOI10.1109/ICSJ.2018.8602653
- 页码41-44