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[IEEE 2018 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) - Chengdu (2018.10.26-2018.10.30)] 2018 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) - Inductance of Different Profiles of Through Glass Vias based on magnetic flux density

[IEEE 2018 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) - Chengdu (2018.10.26-2018.10.30)] 2018 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) - Inductance of Different Profiles of Through Glass Vias based on magnetic flux density

Liu, Yang; Zhu, Zhangming; Ding, Ruixue; Liu, Xiaoxian; Lu, Qijun; Yin, Xiangkun; Yang, Yintang
  • 作者Liu, Yang; Zhu, Zhangming; Ding, Ruixue; Liu, Xiaoxian; Lu, Qijun; Yin, Xiangkun; Yang, Yintang
  • 文件大小3152.09KB
  • 发表时间2018
  • DOI10.1109/APCCAS.2018.8605641
  • 页码439-442
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