Development of A Thermal Expansion Crack Agent
Yang, Weiwei; Liu, Jiping; Liu, Ying; Liu, Xiaobo; Du, Junyi; Han, Jia
- 期刊名称IOP Conference Series: Materials Science and Engineering
- 作者Yang, Weiwei; Liu, Jiping; Liu, Ying; Liu, Xiaobo; Du, Junyi; Han, Jia
- 卷第392卷
- 电子ISSN1757-899X
- 文件大小1640.76KB
- 发表时间2018-08-02
- DOI10.1088/1757-899X/392/3/032025