[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Fabrication of a High Precision Magnetic Position Sensor Based on a Through Silicon Via First Approach

Zoschke, Kai; Oppermann, Hermann; Paul, Johannes; Knoll, Heiko; Braun, Franz-Josef; Saumer, Monika; Theis, Martin; Frank, Peter; Lenkl, Andreas; Klose, Fabian

作者Zoschke, Kai; Oppermann, Hermann; Paul, Johannes; Knoll, Heiko; Braun, Franz-Josef; Saumer, Monika; Theis, Martin; Frank, Peter; Lenkl, Andreas; Klose, Fabian
文件大小33.61KB
发表时间2018
DOI10.23919/IWLPC.2018.8573270
页码1-8

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[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Fabrication of a High Precision Magnetic Position Sensor Based on a Through Silicon Via First Approach