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[IEEE 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Qingdao (2018.10.31-2018.11.3)] 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Modeling Mutual Coupling Capacitance Effects of Package RDL to Chip on Radio Frequency ICs

[IEEE 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Qingdao (2018.10.31-2018.11.3)] 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Modeling Mutual Coupling Capacitance Effects of Package RDL to Chip on Radio Frequency ICs

Xu, Jiansheng; Wang, Xingang
  • 作者Xu, Jiansheng; Wang, Xingang
  • 文件大小2705.90KB
  • 发表时间2018
  • DOI10.1109/icsict.2018.8565687
  • 页码1-3
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