Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations
Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan
- 期刊名称Microelectronics Reliability
- 作者Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan
- 卷第93卷
- 印刷ISSN0026-2714
- 文件大小488.02KB
- 发表时间2019-02
- DOI10.1016/j.microrel.2018.12.010
- 页码81-88