Influence of diffusion and deposition processes on the electrochemical formation of gold amalgam

Wang, Nan; Huang, Zixu; Jiang, Chunbo; Xu, Fei; Liu, Gang; Liu, Xingcen; Sun, Shengjun; Dai, Hongxiu; Ma, Houyi; Lin, Meng

期刊名称Colloids and Surfaces A: Physicochemical and Engineering Aspects
作者Wang, Nan; Huang, Zixu; Jiang, Chunbo; Xu, Fei; Liu, Gang; Liu, Xingcen; Sun, Shengjun; Dai, Hongxiu; Ma, Houyi; Lin, Meng
卷第573卷
印刷ISSN0927-7757
文件大小1519.96KB
发表时间2019-07
DOI10.1016/j.colsurfa.2019.04.061
页码165-169

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