Modeling and Analysis of Signal Integrity of High-Speed Interconnected Channel with Degraded Contact Surface
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Wang, Ziren; Gao, Jinchun; Flowers, George T.; Wu, Yongle; Xie, Gang; Lv, Yinghua
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小7.95KB
- 发表时间2019
- DOI10.1109/TCPMT.2019.2920918
- 页码1-1
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