[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - A SPICE-based Transient Thermal-Electronic Model for LEDs
Sun, Bo; Fan, Jiajie; Fan, Xuejun; Zhang, Guoqi
- 作者Sun, Bo; Fan, Jiajie; Fan, Xuejun; Zhang, Guoqi
- 文件大小240.14KB
- 发表时间2019
- DOI10.1109/EuroSimE.2019.8724555
- 页码1-5