Physically Based Modeling of Hand-Assembled Wire Bundles for Accurate EMC Prediction
- 期刊名称IEEE Transactions on Electromagnetic Compatibility
- 作者Liu, Xiaokang; Grassi, Flavia; Spadacini, Giordano; Pignari, Sergio A.
- 印刷ISSN0018-9375
- 电子ISSN1558-187X
- 文件大小37.00KB
- 发表时间2019
- DOI10.1109/TEMC.2019.2922455
- 页码1-9
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