[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode
Deshpande, Abhishek; Jiang, Qian; Dasgupta, Abhijit; Becker, Ulrich
- 作者Deshpande, Abhishek; Jiang, Qian; Dasgupta, Abhijit; Becker, Ulrich
- 文件大小881.92KB
- 发表时间2019
- DOI10.1109/ITHERM.2019.8757405
- 页码1026-1029