[IEEE 2019 MIXDES - 26th International Conference "Mixed Design of Integrated Circuits and Systems" - Rzeszów, Poland (2019.6.27-2019.6.29)] 2019 MIXDES - 26th International Conference "Mixed Design of Integrated Circuits and Systems" - Detecting PCB Assembly Defects Using Infrared Thermal Signatures
El Belghiti Alaoui, Nabil; Tounsi, Patrick; Boyer, Alexandre; Viard, Amaud
- 作者El Belghiti Alaoui, Nabil; Tounsi, Patrick; Boyer, Alexandre; Viard, Amaud
- 文件大小1087.13KB
- 发表时间2019
- DOI10.23919/MIXDES.2019.8787089
- 页码345-349