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[IEEE 2019 MIXDES - 26th International Conference

[IEEE 2019 MIXDES - 26th International Conference "Mixed Design of Integrated Circuits and Systems" - Rzeszów, Poland (2019.6.27-2019.6.29)] 2019 MIXDES - 26th International Conference "Mixed Design of Integrated Circuits and Systems" - Detecting PCB Assembly Defects Using Infrared Thermal Signatures

El Belghiti Alaoui, Nabil; Tounsi, Patrick; Boyer, Alexandre; Viard, Amaud
  • 作者El Belghiti Alaoui, Nabil; Tounsi, Patrick; Boyer, Alexandre; Viard, Amaud
  • 文件大小1087.13KB
  • 发表时间2019
  • DOI10.23919/MIXDES.2019.8787089
  • 页码345-349
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