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[IEEE 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Singapore, Singapore (2019.3.12-2019.3.15)] 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Modeling of Lateral Migration Mechanism During the Retention Operation in 3D NAND Flash Memories

[IEEE 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Singapore, Singapore (2019.3.12-2019.3.15)] 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Modeling of Lateral Migration Mechanism During the Retention Operation in 3D NAND Flash Memories

Woo, Changbeom; Kim, Shinkeun; Park, Jaeyeol; Lee, Dongiun; Kang, Myounggon; Jeon, Jongwook; Shin, Hyungcheol
  • 作者Woo, Changbeom; Kim, Shinkeun; Park, Jaeyeol; Lee, Dongiun; Kang, Myounggon; Jeon, Jongwook; Shin, Hyungcheol
  • 文件大小354.28KB
  • 发表时间2019
  • DOI10.1109/EDTM.2019.8731083
  • 页码261-263
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