[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Migration of flow inducted hotspot with heat spreader integrated microchannel subjected to asymmetric heat flux: A Multiphysics approach.
- 作者Narendran, G.; Gnanasekaran, N.; Perumal, D. Arumuga
- 文件大小1233.90KB
- 发表时间2019
- DOI10.1109/eurosime.2019.8724568
- 页码1-7
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